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ISP1110
Universal Serial Bus transceiver with UART signaling
Rev. 02 -- 19 March 2007 Product data sheet
1. General description
The ISP1110 is a Universal Serial Bus (USB) transceiver that supports Universal Asynchronous Receiver-Transmitter (UART) signaling mode. The ISP1110 USB transceiver is fully compliant with Universal Serial Bus Specification Rev. 2.0. The ISP1110 can transmit and receive USB data at full-speed (12 Mbit/s). The ISP1110 transceiver allows USB Application Specific Integrated Circuits (ASICs) with I/O power supply voltage from 1.65 V to 2.85 V to interface to the physical layer of the USB. The transceiver has an integrated 5 V-to-3.3 V voltage regulator for direct powering through USB supply line VBUS and an integrated voltage detector to detect the presence of the VBUS voltage on the VCC(5V0) pin. When VBUS is present, the transceiver is in USB mode. When VBUS is not present, the transceiver can be set to UART signaling mode. The ISP1110 transceiver is available in HBCC16 lead-free and halogen-free package.
2. Features
I I I I I I I I I I I I I I I I I Fully complies with Universal Serial Bus Specification Rev. 2.0 Supports USB data transfer at full-speed (12 Mbit/s) Integrated DP pull-up resistor to reduce external components Implemented internal DP pull-up resistor as described in ECN_27%_Resistor Integrated 5 V-to-3.3 V voltage regulator to power through USB line VBUS VBUS voltage presence is indicated on pin VBUSDET Pins VP and VM function in bidirectional mode, allowing pin count saving for ASIC interface Used as a USB peripheral transceiver Stable RCV output during Single-Ended Zero (SE0) condition Two single-ended receivers with hysteresis Low-power operation Supports 2.8 V UART signaling mode on the DP and DM lines Supports VCC(I/O) voltage range from 1.65 V to 2.85 V Supports VCC(UART) voltage range from 2.7 V to 4.5 V Off-state supply current from VCC(UART) is less than 3 A Static current from VCC(I/O) is less than 3 A (typical 1 A) Available in small HBCC16 (3 mm x 3 mm) lead-free and halogen-free package
NXP Semiconductors
ISP1110
USB transceiver with UART signaling
3. Applications
I Mobile phone I Personal Digital Assistant (PDA) I Other portable devices
4. Ordering information
Table 1. Type number ISP1110VH Ordering information Package Name HBCC16 Description plastic thermal enhanced bottom chip carrier; 16 terminals; body 3 x 3 x 0.65 mm Version SOT639-2
5. Block diagram
VCC(UART)
13 POWER SELECTOR VBUS DETECTOR 12 VCC(5V0)
VCC(I/O) UART_EN VBUSDET SOFTCON RXD TXD OE_N RCV VP/VPO VM/VMO SUSPEND
15 16 9 8 1 2 6 3 4 5 7 LEVEL SHIFTER AND CONTROL LOGIC
VOLTAGE REGULATOR 14 DP PULL-UP RESISTOR VREG
11 10
DP DM
ISP1110VH
004aaa678
GND
Fig 1. Block diagram
ISP1110_2
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Product data sheet
Rev. 02 -- 19 March 2007
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NXP Semiconductors
ISP1110
USB transceiver with UART signaling
6. Pinning information
6.1 Pinning
UART_EN
VCC(I/O) 15
16
14
VREG
RXD
1
13
VCC(UART)
TXD RCV VP/VPO
2 3 4
12
VCC(5V0) DP DM
ISP1110VH
11 10
VM/VMO
5
9
VBUSDET
004aaa683
6
OE_N
7 SUSPEND SUSPEND
Transparent top view
Fig 2. Pin configuration HBCC16; top view
VM/VMO
5
SOFTCON
OE_N
SOFTCON
8
9
6
7
8
VBUSDET
VP/VPO RCV TXD
4 3 2
10
DM DP VCC(5V0)
ISP1110VH
GND (exposed die pad) 16 15 14
11 12
RXD
1
13
VCC(UART)
VCC(I/O)
UART_EN
VREG
004aaa684
Bottom view
Fig 3. Pin configuration HBCC16; bottom view
ISP1110_2
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Product data sheet
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NXP Semiconductors
ISP1110
USB transceiver with UART signaling
6.2 Pin description
Table 2. Symbol[1] RXD Pin description Pin 1 Type[2] Description O UART RXD output to microcontroller (CMOS level with respect to VCC(I/O)); driven LOW in USB mode output pad; push pull; 4 mA output drive; CMOS TXD 2 I UART TXD input from microcontroller (CMOS level with respect to VCC(I/O)) input pad; push pull; CMOS RCV 3 O differential data receiver output (CMOS level with respect to VCC(I/O)); driven LOW when input SUSPEND is HIGH; the output state of RCV is preserved and stable during an SE0 condition; driven LOW when in UART mode output pad; push pull; 4 mA output drive; CMOS VP/VPO 4 I/O single-ended DP receiver output VP (CMOS level with respect to VCC(I/O)); for external detection of SE0, error conditions and speed of connected device; this pin also acts as drive data input VPO; see Table 5 and Table 6 bidirectional pad; push-pull input; 3-state output; 4 mA output drive; CMOS VM/VMO 5 I/O single-ended DM receiver output VM (CMOS level with respect to VCC(I/O)); for external detection of SE0, error conditions and speed of connected device; this pin also acts as drive data input VMO; see Table 5 and Table 6 bidirectional pad; push-pull input; 3-state output; 4 mA output drive; CMOS OE_N 6 I USB output enable (CMOS level with respect to VCC(I/O), active LOW); enables the transceiver to transmit data on the USB bus input pad; push pull; CMOS SUSPEND 7 I suspend input (CMOS level with respect to VCC(I/O)); a HIGH level enables low-power state while the USB bus is inactive and drives output RCV to a LOW level; this pin is ignored when in UART mode input pad; push pull; CMOS SOFTCON 8 I software controlled USB connection input; a HIGH level enables the internal DP pull-up resistor when VBUSDET is HIGH; this pin is ignored when in UART mode input pad; push pull; CMOS VBUSDET 9 O VBUS indicator output (CMOS level with respect to VCC(I/O)); when VBUS > VCC(5V0)th, then VBUSDET = HIGH and when VBUS < VCC(5V0)th, then VBUSDET = LOW output pad; push pull; 4 mA output drive; CMOS DM 10 AI/O USB mode -- Negative USB data bus connection (analog, bidirectional, differential) UART mode -- UART TXD line (digital output) DP 11 AI/O USB mode -- Positive USB data bus connection (analog, bidirectional, differential) UART mode -- UART RXD line (digital input)
ISP1110_2
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 -- 19 March 2007
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NXP Semiconductors
ISP1110
USB transceiver with UART signaling
Pin description ...continued Pin 12 13 14 15 Type[2] Description supply voltage input (4.0 V to 5.5 V); can be directly connected to USB line VBUS supply voltage input (2.7 V to 4.5 V) for the UART signaling internal regulator output; a decoupling capacitor of at least 0.1 F is required supply voltage for digital I/O pins (1.65 V to 2.85 V). When VCC(I/O) is not connected, the DP and DM pins are in off-state. This supply pin is totally independent of VCC(5V0) and VREG, and must never exceed VREG. enable UART signaling mode when VCC(5V0) is not present input pad; push-pull; CMOS ground supply; down bonded to the exposed die pad (heat sink); to be connected to the PCB ground
Table 2. Symbol[1] VCC(5V0) VCC(UART) VREG VCC(I/O)
UART_EN GND
16
I
exposed die pad
[1] [2]
Symbol names ending with underscore N, for example, _N, indicate active LOW signals. I = input; O = output; I/O = digital input/output; AI/O = analog input/output.
ISP1110_2
(c) NXP B.V. 2007. All rights reserved.
Product data sheet
Rev. 02 -- 19 March 2007
5 of 25
NXP Semiconductors
ISP1110
USB transceiver with UART signaling
7. Functional description
7.1 Modes of operation
The ISP1110 supports two modes of operation:
* USB mode (3.3 V signaling) * UART mode (2.8 V signaling)
Table 3 shows the definition of various operating modes.
Table 3. VCC(I/O) Off On On On Operating modes: definition VCC(UART) X X on X VCC(5V0) = VBUS X off off on UART_EN X LOW HIGH LOW Mode not defined isolate mode UART mode USB mode
Table 4 shows the pin status in various operating modes.
Table 4. Pin DP DM VP/VPO, VM/VMO RCV VBUSDET RXD UART_EN, TXD, SUSPEND, SOFTCON, OE_N VREG Pin status in various modes Isolate mode not powered not powered high-Z LOW LOW LOW high-Z not powered UART mode high-Z driven (= TXD) LOW when OE_N = HIGH high-Z when OE_N = LOW LOW LOW driven (= DP) high-Z 2.8 V see Table 5 HIGH LOW high-Z 3.3 V USB mode see Table 5 see Table 5 see Table 5
7.1.1 USB mode
When the ISP1110 is in USB mode, pins DP and DM work as the USB D+ and D- lines, respectively. The DP and DM driver is powered by VREG. The USB function is compatible with the ISP1102 transceiver. When the ISP1110 is in USB mode, the TXD input pin is ignored and the RXD output pin is driven LOW. The ISP1110 is in USB mode when VCC(5V0) > VCC(5V0)th and UART_EN is LOW. VCC(I/O) must be on. A short description of the USB detection sequence is: 1. The phone is connected to the USB port of a powered PC. 2. The ISP1110 detects VBUS is above VCC(5V0)th. The ISP1110 enters USB mode and the Analog USB Transceiver (ATX) is powered by VREG.
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Product data sheet
Rev. 02 -- 19 March 2007
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ISP1110
USB transceiver with UART signaling
3. If the phone is switched off (VCC(I/O) is not present), then the DP and DM pins of the ISP1110 remain at high-impedance and the PC will not detect any device attachment. 4. If the phone is switched on (VCC(I/O) is present), then the ISP1110 will drive the VBUSDET pin to a HIGH level. 5. The phone processor detects that pin VBUSDET is HIGH. If the phone system software is ready for USB operation, the phone processor will assert pin SOFTCON. 6. The ISP1110 will enable the DP pull-up resistor (RPU(DP)). 7. The PC detects DP at the HIGH level and starts the USB full-speed enumeration. 8. The PC loads the driver for the phone, if enumeration is successful. For the flowchart, see Section 7.1.3.
7.1.2 UART mode
When the ISP1110 is in UART mode, the DP and DM driver is powered by 2.8 V. The ISP1110 works as a level shifter between these pairs of pins:
* From TXD (VCC(I/O) level) to DM (2.8 V level). * From DP (2.8 V level) to RXD (VCC(I/O) level).
When the ISP1110 is in UART mode, the USB differential receiver is disabled. The SUSPEND and SOFTCON input pins are ignored. The RCV pin is driven LOW. The VP/VPO and VM/VMO pins are driven LOW, if OE_N is HIGH. The VP/VPO and VM/VMO pins are 3-state LOW, if OE_N is LOW. The ISP1110 is in UART mode when VCC(5V0) < VCC(5V0)th and pin UART_EN is HIGH. VCC(I/O) and VCC(UART) must be on. A short description of the UART detection sequence is: 1. The phone is switched on (VCC(I/O) is present). 2. If VBUS is off, the ISP1110 will drive VBUSDET to a LOW level. The ATX is powered by 2.8 V. 3. The ISP1110 will enter UART signaling mode, if UART_EN is HIGH. For the flowchart, see Section 7.1.3.
ISP1110_2
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Product data sheet
Rev. 02 -- 19 March 2007
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NXP Semiconductors
ISP1110
USB transceiver with UART signaling
7.1.3 Mode detection flowchart
START
PHONE IS OFF (VCC(I/O) IS NOT POWERED; DP AND DM ARE OFF-STATE)
NO
VCC(I/O) = ON?
YES
VBUSDET = HIGH?
YES
NO
DP AND DM ARE OFF-STATE AND RXD = LOW
PC IS CONNECTED; ISP1110 IS IN USB MODE
NO
UART_EN = HIGH?
UART_EN = LOW AND SOFTCON = HIGH?
NO
YES UART MODE ENABLED; (TXD DM; DP RXD)
YES DP PULL-UP RESISTOR ENABLED
PHONE IN UART FUNCTION
PHONE IN USB FUNCTION
004aaa681
Fig 4. ISP1110 mode detection flowchart
7.1.4 Mode switching time
When the USB cable is connected, the ISP1110 is in USB mode. When the USB cable is removed and the UART cable is connected, the ISP1110 may switch to UART mode as long as the VBUSDET output is LOW. On the other hand, if the UART cable is removed and the USB cable is connected, the ISP1110 can switch to USB mode.
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Product data sheet
Rev. 02 -- 19 March 2007
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NXP Semiconductors
ISP1110
USB transceiver with UART signaling
UART mode cannot be enabled until the voltage on VCC(5V0) drops below the VBUSDET threshold (0.8 V to 4.0 V). Therefore, the time required to switch from USB mode to UART mode is determined by the RC discharge time on the VBUS line. Given that VCC(5V0) = 5.0 V, R = 100 k and C = 1 F, the discharge time is less than 200 ms (from 5 V to 0.8 V). Assume the detection of the UART cable connect or disconnect is very fast (within 1 ms), the total switching time from the USB cable removal to entering UART mode can be less than 200 ms. The total switching time from the UART cable removal to entering USB mode can be less than 200 ms. When VBUSDET becomes LOW, it is recommended that you wait for 50 ms before asserting UART_EN. This is because there is no hysteresis built for the VBUSDET threshold detector. The time between VBUSDET going HIGH and SOFTCON assertion is 0 ms to 100 ms, according to Universal Serial Bus Specification Rev. 2.0, Section 7.1.7.3.
7.2 Analog USB Transceiver (ATX)
The ISP1110 ATX supports USB full-speed (12 Mbit/s) signaling. The ATX function is compatible with the ISP1102 transceiver. Table 5 shows the function of the ATX.
Table 5. SUSPEND LOW LOW HIGH HIGH
[1] [2]
USB function OE_N LOW HIGH LOW HIGH DP and DM driving/receiving receiving[1] driving high-Z[1] RCV active active inactive[2] inactive[2] VP/VPO VPO input VP output VPO input VP output VM/VMO VMO input VM output VMO input VM output Function normal driving (differential receiver active) receiving driving during suspend (differential receiver inactive) low-power state
Signal levels on the DP and DM pins are determined by other USB devices and external pull-up or pull-down resistors. In suspend mode (SUSPEND = HIGH), the differential receiver is inactive and output RCV is always LOW. The resume signaling is detected through single-ended receivers VP/VPO and VM/VMO.
Table 6. VM/VMO LOW LOW HIGH HIGH Table 7. DP, DM
USB driving function (pin OE_N = LOW) VP/VPO LOW HIGH LOW HIGH USB receiving function (pin OE_N = HIGH) RCV LOW HIGH RCV*[1] VP/VPO LOW HIGH LOW VM/VMO HIGH LOW LOW Data SE0 differential logic 1 differential logic 0 illegal state
Differential logic 0 Differential logic 1 SE0
[1]
RCV* denotes the signal level on output RCV just before the SE0 state occurs. This level is stable during the SE0 period.
ISP1110_2
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Product data sheet
Rev. 02 -- 19 March 2007
9 of 25
NXP Semiconductors
ISP1110
USB transceiver with UART signaling
7.3 VBUS detector
The VBUS detector provides voltage level detection on VBUS, if VBUS is connected to VCC(5V0). If VBUS is greater than VBUS valid threshold VCC(5V0)th, pin VBUSDET will output a HIGH level. Otherwise, pin VBUSDET will output a LOW level. The VBUS detector is powered by VCC(I/O).
7.4 DP pull-up resistor
The internal DP pull-up resistor is connected between the VREG and DP pins, if pin SOFTCON is a HIGH level. The pull-up resistor is context variable, as described in document ECN_27%_Resistor. The variable pull-up resistor hardware is implemented here to meet the ECN_27%_Resistor specification.
7.5 DC-DC regulator
In USB mode, when VCC(5V0) = 4.0 V to 5.5 V, the regulator will output 3.0 V to 3.6 V. In UART mode, when VCC(UART) = 2.7 V to 4.5 V, the regulator will output 2.35 V to 2.85 V. A 0.1 F capacitor is required to connect to the VREG pin.
7.6 Power selector
When VBUSDET = HIGH, the regulator will be powered by VCC(5V0). When VBUSDET = LOW and UART_EN = HIGH, the regulator will be powered by VCC(UART). When VCC(I/O) is not connected, the DP and DM output will be in off-state. For proper operation, the VCC(I/O) voltage must not exceed VREG.
ISP1110_2
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Product data sheet
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NXP Semiconductors
ISP1110
USB transceiver with UART signaling
8. Limiting values
Table 8. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol VCC(5V0) VCC(UART) VCC(I/O) VI Ilu VESD Parameter supply voltage (5.0 V) supply voltage (UART) input/output supply voltage input voltage latch-up current electrostatic discharge voltage VI = -1.8 V to +5.4 V all pins; ILI < 1 A pins DP, DM, VCC(5V0), GND; ILI < 3 A; 1 F capacitor on VCC(5V0) Tstg
[1]
[1] [1]
Conditions
Min -0.5 -0.5 -0.5 -0.5 -2000 -3000
Max +6.0 +5.5 +4.6 VCC(I/O) + 0.5 V 100 +2000 +3000
Unit V V V V mA V V
storage temperature
Equivalent to discharging a 100 pF capacitor through a 1.5 k resistor (Human Body Model).
-40
+125
C
9. Recommended operating conditions
Table 9. Symbol VCC(5V0) VCC(UART) VCC(I/O) VI VIA(I/O) Tamb Tj Recommended operating conditions Parameter supply voltage (5.0 V) supply voltage (UART) input/output supply voltage input voltage input voltage on analog I/O pins pins DP and DM ambient temperature junction temperature Conditions Min 4.0 2.7 1.65 0 0 -40 -40 Typ 5.0 1.8 Max 5.5 4.5 2.85 VCC(I/O) 3.6 +85 +125 Unit V V V V V C C
10. Static characteristics
Table 10. Static characteristics: supply pins VCC(5V0) = 4.0 V to 5.5 V; VCC(UART) = 2.7 V to 4.5 V; VCC(I/O) = 1.65 V to 2.85 V; Tamb = -40 C to +85 C. Typical values are at VCC(5V0) = 5.0 V; VCC(UART) = 2.8 V; VCC(I/O) = 1.8 V; Tamb = +25 C; unless otherwise specified. Symbol VO(VREG) ICC(5V0) Parameter output voltage on pin VREG supply current (5.0 V) Conditions USB mode UART mode USB mode; transmitting and receiving at 12 Mbit/s; CL = 50 pF on pins DP and DM UART mode; 921.6 kbit/s transmitting and receiving at 12 Mbit/s
[2] [2] [1]
Min 3.0 2.35 -
Typ 3.3 2.6 4
Max 3.6 2.85 8
Unit V V mA
ICC(UART) ICC(I/O)
supply current (UART) supply current on pin VCC(I/O)
-
1
4 2
mA mA
ISP1110_2
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Product data sheet
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ISP1110
USB transceiver with UART signaling
Table 10. Static characteristics: supply pins ...continued VCC(5V0) = 4.0 V to 5.5 V; VCC(UART) = 2.7 V to 4.5 V; VCC(I/O) = 1.65 V to 2.85 V; Tamb = -40 C to +85 C. Typical values are at VCC(5V0) = 5.0 V; VCC(UART) = 2.8 V; VCC(I/O) = 1.8 V; Tamb = +25 C; unless otherwise specified. Symbol ICC(5V0)(idle) Parameter idle and SE0 supply current (5.0 V) static supply current on pin VCC(I/O) suspend mode supply current USB mode SUSPEND = HIGH (5.0 V) off-state supply current (UART) supply voltage detection threshold (5.0 V) supply voltage detection threshold (I/O) USB mode or UART_EN = LOW 1.65 V VCC(I/O) 2.85 V
[3]
Conditions USB mode; idle: VDP > 2.7 V, VDM < 0.3 V; SE0: VDP < 0.3 V, VDM < 0.3 V
[3]
Min -
Typ -
Max 300
Unit A
ICC(I/O)(static) ICC(5V0)(susp) ICC(UART)(off) VCC(5V0)th VCC(I/O)th
0.8 0.5
-
3 35 3 4.0 1.4
A A A V V
[1] [2] [3]
The minimum voltage is 2.7 V in suspend mode. Maximum value characterized only, not tested in production. Excluding any load current and source current to the DP/DM pull-up and pull-down resistors (200 A typical).
Table 11. Static characteristics: digital pins VCC(5V0) = 4.0 V to 5.5 V; VCC(UART) = 2.7 V to 4.5 V; VCC(I/O) = 1.65 V to 2.85 V; Tamb = -40 C to +85 C. Typical values are at VCC(5V0) = 5.0 V; VCC(UART) = 2.8 V; VCC(I/O) = 1.8 V; Tamb = +25 C; unless otherwise specified. Symbol Input levels VIL VIH Output levels VOL VOH LOW-level output voltage HIGH-level output voltage IOL = 100 A IOL = 2 mA IOH = 100 A IOH = 2 mA Leakage current ILI Capacitance Cin Input levels VIL VIH Output levels VOL LOW-level output voltage IOL = 100 A IOL = 2 mA 0.15 0.4 V V LOW-level input voltage HIGH-level input voltage 1.2 0.5 V V input capacitance pin to GND 10 pF Example 1: VCC(I/O) = 1.8 V 0.15 V input leakage current
[1]
Parameter
Conditions
Min
Typ
Max
Unit
VCC(I/O) = 1.65 V to 2.85 V LOW-level input voltage HIGH-level input voltage 0.7VCC(I/O) VCC(I/O) - 0.15 V VCC(I/O) - 0.4 V -1 0.3VCC(I/O) 0.15 0.4 +1 V V V V V V A
ISP1110_2
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Product data sheet
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ISP1110
USB transceiver with UART signaling
Table 11. Static characteristics: digital pins ...continued VCC(5V0) = 4.0 V to 5.5 V; VCC(UART) = 2.7 V to 4.5 V; VCC(I/O) = 1.65 V to 2.85 V; Tamb = -40 C to +85 C. Typical values are at VCC(5V0) = 5.0 V; VCC(UART) = 2.8 V; VCC(I/O) = 1.8 V; Tamb = +25 C; unless otherwise specified. Symbol VOH Parameter HIGH-level output voltage Conditions IOH = 100 A IOH = 2 mA Example 2: VCC(I/O) = 2.775 V 0.075 V Input levels VIL VIH Output levels VOL VOH LOW-level output voltage HIGH-level output voltage IOL = 100 A IOL = 2 mA IOH = 100 A IOH = 2 mA
[1]
Min 1.5 1.25
Typ -
Max -
Unit V V
LOW-level input voltage HIGH-level input voltage
3.0 2.55 2.3
-
0.8 0.15 0.4 -
V V V V V V
If VCC(I/O) VCC(UART), then the leakage current will be higher than the specified value when in UART mode.
Table 12. Static characteristics: analog I/O pins DP and DM VCC(5V0) = 4.0 V to 5.5 V; VCC(UART) = 2.7 V to 4.5 V; VCC(I/O) = 1.65 V to 2.85 V; Tamb = -40 C to +85 C. Typical values are at VCC(5V0) = 5.0 V; VCC(UART) = 2.8 V; VCC(I/O) = 1.8 V; Tamb = +25 C; unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Input levels (USB mode) Differential receiver VDI VCM differential input sensitivity differential common mode voltage range LOW-level input voltage HIGH-level input voltage hysteresis voltage LOW-level input voltage HIGH-level input voltage hysteresis voltage LOW-level output voltage HIGH-level output voltage LOW-level output voltage HIGH-level output voltage off-state leakage current input capacitance pin to GND RL = 1.5 k to 3.6 V RL = 15 k to GND IOL = 4 mA IOH = 4 mA
[1]
|VDP - VDM| includes VDI range
0.2 0.8
-
2.5
V V
Single-ended receiver VIL VIH Vhys VIL VIH Vhys VOL VOH VOL VOH ILZ Capacitance Cin
ISP1110_2
2.0 0.4 -0.3 2.0 0.4 2.8 -0.1 2.16 -1 -
-
0.8 0.7 +0.8 3.0 0.7 0.3 3.6 +0.37 2.85 +1 10
V V V V V V V V V V A pF
Input levels (UART mode)
Output levels (USB mode)
Output levels (UART mode)
Leakage current
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Product data sheet
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ISP1110
USB transceiver with UART signaling
Table 12. Static characteristics: analog I/O pins DP and DM ...continued VCC(5V0) = 4.0 V to 5.5 V; VCC(UART) = 2.7 V to 4.5 V; VCC(I/O) = 1.65 V to 2.85 V; Tamb = -40 C to +85 C. Typical values are at VCC(5V0) = 5.0 V; VCC(UART) = 2.8 V; VCC(I/O) = 1.8 V; Tamb = +25 C; unless otherwise specified. Symbol Resistance ZDRV ZINP RPU(DP) Termination VTERM termination voltage for upstream port pull-up (RPU(DP))
[3][4]
Parameter driver output impedance input impedance
Conditions steady-state drive
[2]
Min 34 10 900 1425 3.0
Typ 39 -
Max 44 1575 3090 3.6
Unit M V
pull-up resistance on pin DP bus idle bus active
[1] [2] [3] [4]
VOH(min) = VREG - 0.2 V. Includes external resistors of 33 1 % on pins DP and DM. This voltage is available at pin VREG. The minimum voltage is 2.7 V in suspend mode.
11. Dynamic characteristics
Table 13. Dynamic characteristics: analog I/O pins DP and DM VCC(5V0) = 4.0 V to 5.5 V; VCC(UART) = 2.7 V to 4.5 V; VCC(I/O) = 1.65 V to 2.85 V; Tamb = -40 C to +85 C. Typical values are at VCC(5V0) = 5.0 V; VCC(UART) = 2.8 V; VCC(I/O) = 1.8 V; Tamb = +25 C; unless otherwise specified. Symbol Parameter Driver characteristics (UART mode) tLR tLF transition time: rise time transition time: fall time CL < 250 pF; 10 % to 90 % of |VOH - VOL|; see Figure 5 CL < 250 pF; 90 % to 10 % of |VOH - VOL|; see Figure 5 CL = 50 pF to 125 pF; 10 % to 90 % of |VOH - VOL|; see Figure 5 CL = 50 pF to 125 pF; 90 % to 10 % of |VOH - VOL|; see Figure 5 excluding the first transition from Idle state excluding the first transition from Idle state; see Figure 6 VPO, VMO to DP, DM; see Figure 6 and Figure 9 VPO, VMO to DP, DM; see Figure 6 and Figure 9 OE_N to DP, DM; see Figure 7 and Figure 10 OE_N to DP, DM; see Figure 7 and Figure 10
[2] [1]
Conditions
Min 50 50
Typ -
Max 200 200
Unit ns ns
[1]
Driver characteristics (USB mode) tFR tFF FRFM VCRS rise time fall time differential rise time/fall time matching output signal crossover voltage driver propagation delay (LOW to HIGH) driver propagation delay (HIGH to LOW) driver disable delay from HIGH level driver disable delay from LOW level 4 4 90 1.3 20 20 111.1 2.0 ns ns % V
[3]
Driver timing tPLH(drv) tPHL(drv) tPHZ tPLZ 18 18 15 15 ns ns ns ns
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Product data sheet
Rev. 02 -- 19 March 2007
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NXP Semiconductors
ISP1110
USB transceiver with UART signaling
Table 13. Dynamic characteristics: analog I/O pins DP and DM ...continued VCC(5V0) = 4.0 V to 5.5 V; VCC(UART) = 2.7 V to 4.5 V; VCC(I/O) = 1.65 V to 2.85 V; Tamb = -40 C to +85 C. Typical values are at VCC(5V0) = 5.0 V; VCC(UART) = 2.8 V; VCC(I/O) = 1.8 V; Tamb = +25 C; unless otherwise specified. Symbol Parameter tPZH tPZL driver enable delay to HIGH level Conditions OE_N to DP, DM; see Figure 7 and Figure 10 Min Typ Max 15 15 Unit ns ns
driver enable delay to LOW OE_N to DP, DM; see Figure 7 level and Figure 10
Receiver timings Differential receiver tPLH(rcv) tPHL(rcv) receiver propagation delay (LOW to HIGH) receiver propagation delay (HIGH to LOW) single-ended propagation delay (LOW to HIGH) single-ended propagation delay (HIGH to LOW) DP, DM to RCV; see Figure 8 and Figure 11 DP, DM to RCV; see Figure 8 and Figure 11 DP, DM to VP/VPO, VM/VMO; see Figure 8 and Figure 11 DP, DM to VP/VPO, VM/VMO; see Figure 8 and Figure 11 15 15 ns ns
Single-ended receiver tPLH(se) tPHL(se) 18 18 ns ns
[1] [2] [3]
For UART TXD on pin DM. tFR / tFF. Characterized only, not tested. Limits guaranteed by design.
1.8 V logic input 0.9 V tFR, tLR VOH 90 % 90 % tFF, tLF 0V tPLH(drv) VOH 10 %
004aaa572
0.9 V
tPHL(drv)
VOL
10 %
differential data lines VOL
VCRS
VCRS
004aaa573
Fig 5. Rise time and fall time
Fig 6. Timing of VPO and VMO to DP and DM
2.0 V 0.9 V differential data lines 0.8 V VCRS tPLH(rcv) tPLH(se) VOH logic output
004aaa574
1.8 V logic 0.9 V input 0V VOH differential data lines VOL tPZH tPZL VCRS VOL + 0.3 V
VCRS tPHL(rcv) tPHL(se)
tPHZ tPLZ VOH - 0.3 V
0.9 V
0.9 V
004aaa575
VOL
Fig 7. Timing of OE_N to DP and DM
Fig 8. Timing of DP and DM to RCV, VP/VPO and VM/VMO
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Product data sheet
Rev. 02 -- 19 March 2007
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ISP1110
USB transceiver with UART signaling
12. Test information
test point D.U.T. DP or DM
33 CL 15 k
004aaa680
Load capacitance CL = 50 pF (minimum or maximum timing)
Fig 9. Load on pins DP and DM
33
test point
500
D.U.T.
DP or DM
50 pF
V
004aaa517
V = 0 V for tPZH and tPHZ V = VREG for tPZL and tPLZ
Fig 10. Load on pins DP and DM for enable time and disable time
test point D.U.T.
25 pF
004aaa709
Fig 11. Load on pins VM/VMO, VP/VPO and RCV
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Product data sheet
Rev. 02 -- 19 March 2007
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NXP Semiconductors
ISP1110
USB transceiver with UART signaling
13. Package outline
HBCC16: plastic thermal enhanced bottom chip carrier; 16 terminals; body 3 x 3 x 0.65 mm SOT639-2
b D B A f terminal 1 index area E
vMCAB wMC vMCAB wMC
b1
b3
vMCAB wMC
b2 detail X
vMCAB wMC
e1 Dh e 5 9 y1 C
C y
e e4 1/2 e4 Eh e2
1 16 1/2 e3 e3
13 X A2 A A1
0
2.5 scale
5 mm
DIMENSIONS (mm are the original dimensions) UNIT mm A max. 0.8 A1 0.10 0.05 A2 0.7 0.6 b 0.33 0.27 b1 0.33 0.27 b2 0.38 0.32 b3 0.38 0.32 D 3.1 2.9 Dh 1.45 1.35 E 3.1 2.9 Eh 1.45 1.35 e 0.5 e1 2.5 e2 2.5 e3 2.45 e4 2.45 f 0.23 0.17 v 0.08 w 0.1 y 0.05 y1 0.2
OUTLINE VERSION SOT639-2
REFERENCES IEC JEDEC MO-217 JEITA
EUROPEAN PROJECTION
ISSUE DATE 01-11-13 03-03-12
Fig 12. Package outline SOT639-2 (HBCC16)
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Product data sheet
Rev. 02 -- 19 March 2007
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USB transceiver with UART signaling
14. Packing information
The ISP1110VH (HBCC16 package) is delivered on a Type A carrier tape, see Figure 13. The tape dimensions are given in Table 14. The reel diameter is 330 mm. The reel is made of polystyrene and is not designed for use in a baking process. The cumulative tolerance of 10 successive sprocket holes is 0.02 mm. The camber must not exceed 1 mm in 100 mm.
4
A0
K0
W
B0
P1
type A
direction of feed
4
A0
K0
W
B0
elongated sprocket hole
P1
type B
direction of feed
004aaa728
Fig 13. Carrier tape dimensions Table 14. A0 B0 K0 P1 W Type A carrier tape dimensions for the ISP1110VH Value 3.3 3.3 1.1 8.0 12.0 0.3 Unit mm mm mm mm mm
Dimension
15. Soldering
This text provides a very brief insight into a complex technology. A more in-depth account of soldering ICs can be found in Application Note AN10365 "Surface mount reflow soldering description".
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USB transceiver with UART signaling
15.1 Introduction to soldering
Soldering is one of the most common methods through which packages are attached to Printed Circuit Boards (PCBs), to form electrical circuits. The soldered joint provides both the mechanical and the electrical connection. There is no single soldering method that is ideal for all IC packages. Wave soldering is often preferred when through-hole and Surface Mount Devices (SMDs) are mixed on one printed wiring board; however, it is not suitable for fine pitch SMDs. Reflow soldering is ideal for the small pitches and high densities that come with increased miniaturization.
15.2 Wave and reflow soldering
Wave soldering is a joining technology in which the joints are made by solder coming from a standing wave of liquid solder. The wave soldering process is suitable for the following:
* Through-hole components * Leaded or leadless SMDs, which are glued to the surface of the printed circuit board
Not all SMDs can be wave soldered. Packages with solder balls, and some leadless packages which have solder lands underneath the body, cannot be wave soldered. Also, leaded SMDs with leads having a pitch smaller than ~0.6 mm cannot be wave soldered, due to an increased probability of bridging. The reflow soldering process involves applying solder paste to a board, followed by component placement and exposure to a temperature profile. Leaded packages, packages with solder balls, and leadless packages are all reflow solderable. Key characteristics in both wave and reflow soldering are:
* * * * * *
Board specifications, including the board finish, solder masks and vias Package footprints, including solder thieves and orientation The moisture sensitivity level of the packages Package placement Inspection and repair Lead-free soldering versus PbSn soldering
15.3 Wave soldering
Key characteristics in wave soldering are:
* Process issues, such as application of adhesive and flux, clinching of leads, board
transport, the solder wave parameters, and the time during which components are exposed to the wave
* Solder bath specifications, including temperature and impurities 15.4 Reflow soldering
Key characteristics in reflow soldering are:
* Lead-free versus SnPb soldering; note that a lead-free reflow process usually leads to
higher minimum peak temperatures (see Figure 14) than a PbSn process, thus reducing the process window
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Product data sheet
Rev. 02 -- 19 March 2007
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ISP1110
USB transceiver with UART signaling
* Solder paste printing issues including smearing, release, and adjusting the process
window for a mix of large and small components on one board
* Reflow temperature profile; this profile includes preheat, reflow (in which the board is
heated to the peak temperature) and cooling down. It is imperative that the peak temperature is high enough for the solder to make reliable solder joints (a solder paste characteristic). In addition, the peak temperature must be low enough that the packages and/or boards are not damaged. The peak temperature of the package depends on package thickness and volume and is classified in accordance with Table 15 and 16
Table 15. SnPb eutectic process (from J-STD-020C) Package reflow temperature (C) Volume (mm3) < 350 < 2.5 2.5 Table 16. 235 220 Lead-free process (from J-STD-020C) Package reflow temperature (C) Volume (mm3) < 350 < 1.6 1.6 to 2.5 > 2.5 260 260 250 350 to 2000 260 250 245 > 2000 260 245 245 350 220 220
Package thickness (mm)
Package thickness (mm)
Moisture sensitivity precautions, as indicated on the packing, must be respected at all times. Studies have shown that small packages reach higher temperatures during reflow soldering, see Figure 14.
temperature
maximum peak temperature = MSL limit, damage level
minimum peak temperature = minimum soldering temperature
peak temperature
time
001aac844
MSL: Moisture Sensitivity Level
Fig 14. Temperature profiles for large and small components
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Product data sheet
Rev. 02 -- 19 March 2007
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ISP1110
USB transceiver with UART signaling
For further information on temperature profiles, refer to Application Note AN10365 "Surface mount reflow soldering description".
16. Abbreviations
Table 17. Acronym ASIC ATX CMOS HBM PDA RXD SE0 TXD UART USB Abbreviations Description Application Specific Integrated Circuits Analog USB Transceiver Complementary Metal-Oxide Semiconductor Human Body Model Personal Digital Assistant Receive Data Single-Ended Zero Transmit Data Universal Asynchronous Receiver-Transmitter Universal Serial Bus
17. References
[1] [2] Universal Serial Bus Specification Rev. 2.0 ECN_27%_Resistor (Pull-up/pull-down Resistors ECN)
18. Revision history
Table 18. ISP1110_2 Modifications: Revision history Release date 20070319 Data sheet status Product data sheet Change notice Supersedes ISP1110_1 Document ID
* * * * * * *
The format of this data sheet has been redesigned to comply with the new identity guidelines of NXP Semiconductors. Legal texts have been adapted to the new company name where appropriate. Table 2 "Pin description": updated description for pin 6. Section 7.1 "Modes of operation": updated Table 3 and added Table 4. Section 7.1.1 "USB mode": updated third paragraph. Section 7.1.2 "UART mode": updated fourth paragraph. Table 9 "Recommended operating conditions": added Tj. Product data sheet -
ISP1110_1
20060323
ISP1110_2
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Product data sheet
Rev. 02 -- 19 March 2007
21 of 25
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ISP1110
USB transceiver with UART signaling
19. Legal information
19.1 Data sheet status
Document status[1][2] Objective [short] data sheet Preliminary [short] data sheet Product [short] data sheet
[1] [2] [3]
Product status[3] Development Qualification Production
Definition This document contains data from the objective specification for product development. This document contains data from the preliminary specification. This document contains the product specification.
Please consult the most recently issued document before initiating or completing a design. The term `short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com.
19.2 Definitions
Draft -- The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet -- A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail.
malfunction of a NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors accepts no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) may cause permanent damage to the device. Limiting values are stress ratings only and operation of the device at these or any other conditions above those given in the Characteristics sections of this document is not implied. Exposure to limiting values for extended periods may affect device reliability. Terms and conditions of sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, including those pertaining to warranty, intellectual property rights infringement and limitation of liability, unless explicitly otherwise agreed to in writing by NXP Semiconductors. In case of any inconsistency or conflict between information in this document and such terms and conditions, the latter will prevail. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights.
19.3 Disclaimers
General -- Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in medical, military, aircraft, space or life support equipment, nor in applications where failure or
19.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners.
20. Contact information
For additional information, please visit: http://www.nxp.com For sales office addresses, send an email to: salesaddresses@nxp.com
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Product data sheet
Rev. 02 -- 19 March 2007
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USB transceiver with UART signaling
21. Tables
Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Table 14. Table 15. Table 16. Table 17. Table 18. Ordering information . . . . . . . . . . . . . . . . . . . . .2 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . .4 Operating modes: definition . . . . . . . . . . . . . . . .6 Pin status in various modes . . . . . . . . . . . . . . . .6 USB function . . . . . . . . . . . . . . . . . . . . . . . . . . .9 USB driving function (pin OE_N = LOW) . . . . . .9 USB receiving function (pin OE_N = HIGH) . . .9 Limiting values . . . . . . . . . . . . . . . . . . . . . . . . .11 Recommended operating conditions . . . . . . . .11 Static characteristics: supply pins . . . . . . . . . .11 Static characteristics: digital pins . . . . . . . . . . .12 Static characteristics: analog I/O pins DP and DM . . . . . . . . . . . . . . . . . . . . . . . . . . .13 Dynamic characteristics: analog I/O pins DP and DM . . . . . . . . . . . . . . . . . . . . . . . . . . .14 Type A carrier tape dimensions for the ISP1110VH . . . . . . . . . . . . . . . . . . . . . . . . . . .18 SnPb eutectic process (from J-STD-020C) . . .20 Lead-free process (from J-STD-020C) . . . . . .20 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . .21 Revision history . . . . . . . . . . . . . . . . . . . . . . . .21
continued >>
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Product data sheet
Rev. 02 -- 19 March 2007
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ISP1110
USB transceiver with UART signaling
22. Figures
Fig 1. Fig 2. Fig 3. Fig 4. Fig 5. Fig 6. Fig 7. Fig 8. Fig 9. Fig 10. Fig 11. Fig 12. Fig 13. Fig 14. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . .2 Pin configuration HBCC16; top view . . . . . . . . . . .3 Pin configuration HBCC16; bottom view . . . . . . . .3 ISP1110 mode detection flowchart . . . . . . . . . . . .8 Rise time and fall time . . . . . . . . . . . . . . . . . . . . .15 Timing of VPO and VMO to DP and DM . . . . . . .15 Timing of OE_N to DP and DM . . . . . . . . . . . . . .15 Timing of DP and DM to RCV, VP/VPO and VM/VMO . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15 Load on pins DP and DM. . . . . . . . . . . . . . . . . . .16 Load on pins DP and DM for enable time and disable time . . . . . . . . . . . . . . . . . . . . . . . . . . . . .16 Load on pins VM/VMO, VP/VPO and RCV . . . . .16 Package outline SOT639-2 (HBCC16). . . . . . . . .17 Carrier tape dimensions. . . . . . . . . . . . . . . . . . . .18 Temperature profiles for large and small components . . . . . . . . . . . . . . . . . . . . . . . . . . . . .20
continued >>
ISP1110_2
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Product data sheet
Rev. 02 -- 19 March 2007
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ISP1110
USB transceiver with UART signaling
23. Contents
1 2 3 4 5 6 6.1 6.2 7 7.1 7.1.1 7.1.2 7.1.3 7.1.4 7.2 7.3 7.4 7.5 7.6 8 9 10 11 12 13 14 15 15.1 15.2 15.3 15.4 16 17 18 19 19.1 19.2 19.3 19.4 20 21 22 23 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Pinning information . . . . . . . . . . . . . . . . . . . . . . 3 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 6 Modes of operation . . . . . . . . . . . . . . . . . . . . . . 6 USB mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 UART mode . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Mode detection flowchart . . . . . . . . . . . . . . . . . 8 Mode switching time . . . . . . . . . . . . . . . . . . . . . 8 Analog USB Transceiver (ATX) . . . . . . . . . . . . . 9 VBUS detector . . . . . . . . . . . . . . . . . . . . . . . . . 10 DP pull-up resistor . . . . . . . . . . . . . . . . . . . . . 10 DC-DC regulator . . . . . . . . . . . . . . . . . . . . . . . 10 Power selector . . . . . . . . . . . . . . . . . . . . . . . . 10 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 11 Recommended operating conditions. . . . . . . 11 Static characteristics. . . . . . . . . . . . . . . . . . . . 11 Dynamic characteristics . . . . . . . . . . . . . . . . . 14 Test information . . . . . . . . . . . . . . . . . . . . . . . . 16 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 17 Packing information. . . . . . . . . . . . . . . . . . . . . 18 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Introduction to soldering . . . . . . . . . . . . . . . . . 19 Wave and reflow soldering . . . . . . . . . . . . . . . 19 Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 19 Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 19 Abbreviations . . . . . . . . . . . . . . . . . . . . . . . . . . 21 References . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 21 Legal information. . . . . . . . . . . . . . . . . . . . . . . 22 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 22 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 Contact information. . . . . . . . . . . . . . . . . . . . . 22 Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
Please be aware that important notices concerning this document and the product(s) described herein, have been included in section `Legal information'.
(c) NXP B.V. 2007.
All rights reserved.
For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 19 March 2007 Document identifier: ISP1110_2

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